Simulating the cooling of electronic components:
A powerful cooling simulation tool based on the Ansys Fluent computational fluid dynamics (CFD) solver.
Ansys Icepak can predict air flow, temperature and heat transfer in IC packages, PCBs, electronic devices and power electronics. The system has CAD-centric (mechanical and electrical CAD) and multiphysics user interfaces. It also makes it possible to solve the most complex thermal management problems relating to electronic products and assemblies. Icepak uses sophisticated CAD algorithms that reduce simulation times, while at the same time providing highly accurate solutions. A high degree of solution precision guarantees accurate representation of the electronic application.
• Joule heating analysis
• Multiple-fluid analysis
• Concentrated parameter analysis (ROM)
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