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Elevate Engineering Design – 2022 Product Releases & Updates

3D Design
Ansys 2022 R1 expands Discovery’s astonishing Live physics in the critical area of thermal management through the addition of coupled fluid-solid simulation. This fast, fault-tolerant approach means that the simulation of heat exchangers, liquid cooling devices, and exhaust systems is now dramatically easier to perform and up to 50x faster allowing testing of more design variations for expanded insight and discovery. This is yet another example of how Discovery opens up simulation insights to a much broader set of engineers.
The 2022 R1 release also provides the addition of key features for the analyst using Discovery as a model prep tool, such as beam and shell modeling, flex cable wrapping, and small units support. Lastly, productivity enhancements to Discovery’s award-winning user interface provided more automation for a seamless connected workflow from CAD through to simulation.

· Fast and easy thermal management – Coupled fluid-solid thermal analysis for Live physics allows fast prediction of heat dissipation and transfer under many fluid flow scenarios.
· Geometry preprocessing – Support for beams and shells, flex cable wrapping, and small units make Discovery a compelling tool for working with a wide range of geometries and use cases
· Workflow Innovation – Expanded history tracking, improved hinge and spherical joints, as well as new postprocessing capabilities, such as local slice monitors and interactive probes, accelerate the simulation journey from setup to results.
· Additional physics – Compressible flow for both Live and High-fidelity physics, temperature-dependent material properties, and 1D springs expand the scope and depth of Discovery’s simulation capabilities.

Acoustics Simulations

In 2022 R1, Ansys Sound features new capabilities, including a fully released Frequency Response Function (FRF), a loudness color map display for ISO 532-1 and tonality indicators that can be calculated in display order.
Users can reduce noise annoyance with tonality indicators that can be calculated in display order with the ability to switch order levels.
The new FRF capability allows users to characterize the transfer function of a system by estimating frequency response and minimizing the effect of noise for the receiver.
A new capability allows sound loudness (ISO 532-1) to be displayed as a colormap to ultimately reduce noise annoyance.


Ansys 2022 R1 continues to expand toolsets for Additive Manufacturing Users, streamlining your workflows between design, simulation, and manufacturing. In addition, every Ansys Mechanical User can now identify and minimize risk for build errors and ensure high-quality parts through process simulation for metal Powder Bed Fusion (PBF), Directed Energy Deposition (DED), and Metal Binder Jet.

· Streamline your workflows with Directed Energy Deposition (DED) – introducing DED process simulation to the Ansys Additive Portfolio, providing capabilities from predicting macro-level temperature distortions and stresses to prevent build failures and provide trend data for improving designs for additive manufacturing including part orientation and part build order.
· Continued improvements for Power Bed Fusion (PBF) process simulation– double the strain generation speed for Scan Pattern simulations, paired with an expanding material library.
· Workflow speed improvements – fully threaded solver support, multi-platform additive wizard support, MAPDL solver enhancements, and now providing a seamless transfer from Ansys Additive Products to Workbench and Mechanical.
· Expanded manufacturing possibilities through Metal Binder Jet (Beta) – predicting large distortion and shrinkage during the furnace sintering process; as well as expanding the process simulation portfolio with the ability to identify, compensate and optimize the additive manufacturing process.

Autonomous Vehicle Simulation

The 2022 R1 release continues to drive an open architecture with the ability to connect Ansys physics-based sensors to third party driving simulators like IPG Automotive CarMaker or Carla, while bringing new innovations for sensor definition. You can quickly and easily verify and validate your ADAS/AV feature including sensor (radar, lidar and camera) perception with the driving simulation tool of your choice. And, with new radar and LiDAR functionality, you can validate larger and more complex sensors regardless of GPU constraints.
With Ansys 2022 R1, Ansys AVxcelerate continues to accelerate the development of safe autonomous driving by introducing major features with key partners.
New co-simulation capabilities with IPG Automotive CarMaker allow OEMs and automotive suppliers to ensure the safety of ADAS feature and autonomous vehicle by validating perception, fusion and control algorithm using Ansys physics-based sensors simulation (camera, radar, lidar) in sync with IPG Automotive CarMaker vehicle dynamics and scenarios.
With new radar and LiDAR features, GPU memory is no longer a limit in simulating large and complex sensors because AVxcelerate automatically adapts to available resources. Additionally, Ansys’s unique real-time radar model now considers surface roughness in the simulation outputs.

Ansys Cloud

Admin Controls
• Access the Admin controls from the Ansys Cloud portal without a Cloud Essential Subscription
• Manage user groups and company projects
• Control simulation costs by allocating budgets to projects and tracking usage
• Assign Cloud Storage subscriptions to users for more control over additional Ansys Cloud storage
User Experience
• Improved user experience with new and redesigned Ansys Cloud Dashboard
• Enriched Job-Sharing Capabilities. Share jobs/sessions with:
• User Groups for efficient collaboration in the cloud
• Ansys Support for debugging
• Submit custom batch jobs using the Generic Solver Template via the Ansys Cloud portal Connect (formerly called Platform).

The Ansys Connect product collection replaces Ansys Platform with 2022 R1 release and now includes Ansys Minerva, Ansys optiSLang, Ansys Granta (Granta MI Enterprise, Granta MI Pro and Selector) and Ansys ModelCenter. Ansys connect allows you to create a connected digital thread by connecting various simulation tools and the corresponding assets with each other and with the rest of the product lifecycle ecosystem such as CAD designs, requirements database, system architecture model, and more.
Highlights includes:
Ansys optiSLang’s new connectors for LS-Dyna, SpaceClaim, Nastran and ModelCenter along with the new AI/ML-based optimization algorithms from Probaligence enables orchestrated and optimized simulation workflows.
Ansys Minerva allows simulation experts to create apps from their simulation automations that nonexperts can take advantage of – thus minimizing the expertise gap
Ansys New in 2022 R1, Ansys ModelCenter improves the connection between your systems architecture models (SAM) and project requirements to build more accurate simulation models.
Ansys Cloud releases enhanced admin capabilities that include the ability for admins to create and manage User Groups, and ability to allocate budgets to company projects and monitor cloud usage.

Digital Mission Engineering

STK in this release offers users an array of new features and improvements, including enhanced new tools to support large satellite mega-constellations, a seamless new ability to quickly move 3D models from a CAD package into STK, new Fast Lambert profiles for Astrogator, and more.

Additional RPO Capabilities

With the addition of new curvilinear calculation objects, users can now compute quantities that are more naturally consistent with a given orbit. Not only do these values more accurately capture the desired quantities, they also reduce computational complexity when solving for trajectories, as the numerics no longer have to mitigate the errors introduced by linear iteration steps.
FMI/FMU compatibility plugin
The use of reduced order models (ROM) as a means of reducing simulation run time is crucial to maximizing the effectiveness of the Digital Mission Engineering ecosystem. In the concept design phase of the engineering life cycle, it’s necessary to evaluate as many alternatives as possible before committing to any one design path. The ability to integrate with multiple Ansys physics solvers through FMUs allows a more representative mission simulation that accounts for dynamical characteristics of various mechanical, electronic and fluids subsystems.

Ansys Discovery CAD to STK

The ability to quickly move 3D models from a CAD package into a mission simulation has long been a desire for analysts and operators. Whether the aim is to refine an ongoing design that has specific mission requirements it has to meet, or there is a need to assess an evolutionary design in an already operational system, this is a critical link in the digital thread, tying the entire engineering lifecycle together. The new STK plugin to Ansys Discovery provides a seamless method for converting a detailed CAD model into an STK consumable glTF format. But beyond just performing a simple conversion, the plugin allows CAD models to be imbued with additional features such as sensor attach points, steerable elements, and articulations.

Digital Twin

The new release of Ansys Twin Builder delivers predictive analytics with up to 98% level of accuracy by combining physical and virtual sensors. New features available to enable faster deployment of your digital twin, easier workflows, and Web-App application for online interaction with your model.
Easily Export and Deploy Digital Twin
Twin Deployer with Hybrid Analytics: Calibrate and tune your simulation model parameters by combining physical and virtual sensors, to match data with your simulation outputs. With the help of online calibration, recalibrate in-production digital twin, without the need to build a new one!
Export Web App from Twin Deployer: Develop quick web application prototype by exporting Web App from Twin Deployer.
Twin State-Saving: Twin SDK now support State-Saving enabling restart of the simulation and what-if scenarios.
Reduce Order Model Enhancements Constraints on ROM Output: Better control ROM output to ensure ROM outputs meat physical constraints by applying constraints on ROM outputs.
Dynamic ROM Builder: New Solver available up to 10 time faster Modelica Enhancements:
Conditional Connector and Parameter Support: Easily customize your components with the help of conditional connectors and parameters and reuse same model for different scenarios.
User Experience: Enhancements in Creation & Edition, Annotation Text and Clone uncompiled models.


With 2022 R1, Ansys Electronics solutions continue to bring best-in-class technologies to address PCB, 3D IC package, EMI/EMC, thermal, cabling, and electromechanical design challenges with significant advancements in 5G, autonomous and electrification simulation. Below are some of the top enhancements in each of the electronics solutions,
HFSS – An automotive radar surface roughness model in HFSS SBR+ provides an efficient method for modeling rough surface non-specular reflection such as from asphalt or concrete boosting the realism of radar simulation outputs.
Maxwell – Announcing Litz Wire loss prediction ability from two-way thermal coupling with thermal solvers in Workbench and Ansys Electronics Desktop. A unique capability benefiting all Engineers designing Magnetic components of any power electronic configuration.
SIwave – It can now read temperature gradients from Icepak and becomes first in the industry to run AC simulations such as SYZ extraction and impedance and crosstalk scanners. This allows engineers to understand the temperature effects on the Signal Integrity of their designs.
Icepak – It now allows for a 2-way link between RedHawk for CTM import and HTC export for a more accurate chip/package thermal solution
Motor-CAD – The NVH of an electric machine can now be rapidly evaluated and assessed in the early stages of design and included as part of the multi-physics evaluation of a candidate design with Motor-CAD. This helps to avoid NVH issues arising at the later stages of development where the cost of change is high.
EMA3D CABLE – Introduction of the EMA3D and Nexxim transient circuit co-simulation ability allows engineers to simulate the complexity of devices and platforms down to the circuit level and reduce the time to simulate by more than a factor of ten.
EMA3D Charge – New dielectric breakdown capability in EMA3D Charge will allow aerospace engineers to evaluate designs with risk of dielectric breakdown and Electronics engineers to assess the risk of dielectric breakdown between PCB traces. This will benefit spacecraft, solar panels, high voltage solids insulators, cables, and connector design.
Nuhertz FilterSolutions – Automated discrete optimization enables optimization of planar filter designs across standard value components available from vendors. Designers of planar filters based on standard vendor parts will be able to synthesize and optimize filters as well as simulate yield analysis.

Embedded Software

Ansys 2022 R1 continues to grow leading capabilities to support international standards for safe and interoperable embedded software in A&D (DO-178C, ARINC 661, FACE), Automotive (ISO 26262, AUTOSAR) and Industry (IEC 62508, EN 50128).
Moreover, software V&V activities can be even further accelerated thanks to a unique model coverage assistance capability brought to designers and testers.
Enhancements include:
New visual identity and UX improvements for SCADE Suite. Including new capability like Digital Verifier, plus the further expanded AUTOSAR Classic support
Cockpit Display System DO-178C certification guidelines and SCADE Display graphic effects library has been added into SCADE Display
SCADE Architect and Avionics package now has full support of FACE 3.1 modeling with improved UX in the browser.
Model Coverage Assistance and ALM Gateway have been implemented into SCADE Test and SCADE Lifecycle.


This release features major enhancements in the Fluids portfolio; accelerating meshing, setup and solve time, including:
An aerospace dedicated workspace in Ansys Fluent streamlines external aerodynamics simulations with built-in best practices, optimized solver settings, parametric capabilities and more.
A brand-new Multi-GPU Fluent solver (beta) accelerates steady-state simulations, with results showing 4 high-end GPUs provide the same performance as more than 1,000 CPUs.
Efficiently run acoustics simulations in Fluent with the new sponge layer treatment and perform sophisticated analyses with sound composition and runtime Discrete Fourier Transform (DFT) framework.
Ansys TurboGrid’s hybrid meshing technology automates the meshing of complex turbomachinery blade designs.
Accelerate Ansys Rocky simulations by reducing computation in regions with low particle interaction using a dynamic domain capability.
Ansys Forte’s Eulerian two-phase mixture approach to modeling liquids and two-phase mixtures enables quick and accurate simulation of liquid pumps and valves.


2022 R1 sees Ansys Materials expand its data and tools offering into the 5G, electronics and electrification technology areas – extending Ansys Material Intelligence to Ansys Electromagnetic Simulation.
For the first time Ansys Granta MI™ will incorporate Machine Learning capabilities for intelligent additive manufacturing. Optimize the relevant parameters to meet your target criteria to reduce sample manufacture and characterization of additive materials previously done by trial and error.
EMI/EMC, Electric Machine, SI/PI and Thermal engineers using Ansys Electronics Desktop tools can now access Granta MI in their native solvers – with access to a new range of 7,200+ electromagnetic materials records. For faster, more accurate and traceable electromagnetic design simulation.
The volume of data for additive manufacturing continues to grow. To harness this trend Machine Learning capabilities have been integrated into Granta MI™ for process parameter optimization, data visualization and training. Bringing value to sparse and noisy additive data.
Assess a material’s environmental impact by using the comprehensive sustainability data in the unique MaterialUniverse™ – updated with the latest ecoinvent data for all engineering materials.
Significant enhancement in our range of polymer data for non-linear material models – now with over 105,000 polymers.


Ansys 2022 R1 brings exciting new advancements for fluid-structure interaction simulations, electro-thermal analyses, and other multiphysics simulations performed using System Coupling. These extensions add to our growing multiphysics coupling capabilities. Enhancements include:
A new extrapolation method that improves mapping for non-overlapping regions
Mapping improvements for faster co-simulation with less memory
Usability improvements including a new chart view and help for restarts
New 2.0 APIs that provide volume mapping and the exchange of complex solution data and additional variable attributes for participants adopting these new APIs


Ansys Speos continues to push the innovation envelope to deliver accurate, high performance simulation capabilities for optics designers. The 2022 R1 release delivers powerful capabilities that speed time to result, improve simulation accuracy, and expand interoperability with other Ansys products.

Productivity Enhancements

LightField, a new Ansys file format to facilitate the storage and sharing of pre-computed intermediate simulation results for sub-structures within an optical system to improve simulation time and allow for block-box sharing between suppliers and their customers for improved performance and IP protection.
Parameter Manager offers an expanded set of exposed parameters to enable the optimization of a broader set of Speos designs including light guides and projection lens.
Surface property plug-in capabilities to allow for custom optical surface models written in C++ or Python. New models can allow the use of third-party material description and the use of data coming from other Ansys tools such as Lumerical FDTD.
Other productivity enhancements including preset manager, UX enhancements, and the accelerated import of CATIA projects.
Speos GPU Acceleration
Speos now offers GPU Compute delivering dramatic improvements to simulation performance (benchmarks indicate a 140x to 260x speedup on average) with no loss in accuracy and with an unprecedented performance to cost ratio.
Speos Live Preview, a GPU accelerated preview providing 100% true-to-life simulation results that match those produced with Speos CPU, is now available for Speos for NX.
Sensors for Autonomous Driving
New post-processing to better model dynamic scene effects such as roller shutter and motion blur.

Ansys Integration

Graded material models to capture the effects of non-homogeneity on refractive index and absorption.
Speos now models aero-optical phenomenon to account for aberration effects of compressible turbulent flows near the projection or viewing optical aperture.
Interoperability with Ansys mechanical to enable the simulation of effects of mechanical deformation on optical properties.
New productivity features for Ansys Cloud including flexible queues with adjustable core counts.


Ansys Lumerical continues to push the innovation envelope to deliver accurate, high performance simulation capabilities for photonics designers. The 2022 R1 release delivers powerful capabilities that speed time to result, improve simulation accuracy, and expand interoperability with other Ansys products.
Ansys Cloud HPC Services Integration
Lumerical Simulations are now compatible with the powerful Ansys Cloud.
Submit large simulations and parameter sweeps to Ansys Cloud directly from Lumerical tools.
Access to HPC cloud performance hardware, on-demand pricing, and completely secure workflows
Interoperability with Ansys Speos and Ansys optiSLang
New surface model creation for Speos (BSDF and diffraction gratings) allows you to account for visual perception effects with Speos Human Vision (beta availability).
Updates to support optiSLang workflows including advanced optimization with Lumerical STACK for display applications (beta availability).
Photonic Integrated Circuits
Support for process enabled custom active PIC component design with Layer Builder.
New and improved Lumerical INTERCONNECT and Verilog-A photonic model support in Lumerical CML Compiler.
Several usability improvements for Lumerical CML Compiler including new commands for easy deployment of individual templates and for checking the build status of elements in the library.

Virtuoso Layout Integration

Direct bridge to communicate layout data between Virtuoso and FDTD/MODE enabling direct parameter extraction and optimization of p-cells.

KLayout Integration
New integration between Ansys Lumerical INTERCONNECT and KLayout, enables a layout driven design and simulation workflow for photonic integrated circuits.
Laser Self-Heating
Simulate effects of self-heating on solid-state laser performance in PIC by directly importing measured or simulated gain spectra with current and temperature dependence into Lumerical INTERCONNECT.

Photonics Core Technologies

Lumerical FEEM now supports waveguide bends.
RCWA solver for fast simulation of multi-layer stacks with periodicity and surface patterning (beta availability).

Safety Analysis

In Ansys 2022 R1, Ansys medini analyze provides new features that further enable the efficient holistic application of safety, reliability, and cybersecurity analysis methods. The tool enables our customers to be compliant with latest applicable industry domain standards.
• Aerospace – benefit from fully ARP4761(A) standard compliant fault tree analysis that is combined with even further improved usability.
• Automotive – incorporate latest ISO 21434 (released 08/2021) automotive cybersecurity analysis.
• Digital Safety Manager – project dashboard provides configurable KPIs allow users to track and follow the safety project progress derived automatically from actual project data.
• Hardware and Semiconductor – variability support in FMEDA that dramatically reduces the efforts when delivering variants of users from designs to multiple customers.


2022 R1 introduces a new technology option to the RedHawk family: SigmaDVD, a once-in-a-decade technology breakthrough that identifies the worst-case dynamic voltage-drop in hours instead of months. This novel, statistically realistic modeling technique makes it possible for the first time to achieve near 100% coverage of all possible switching scenarios, making chip designs more robust and giving chip designers greatly expanded confidence in RedHawk’s golden signoff analysis.
· RedHawk-SC continues to deliver performance improvements (reduced simulation time) of up to 30% with gold standard accuracy, particularly for small block runtimes.
· Ansys has collaborated with our partner, Synopsys, to deliver IR-ECO – a new solution to joint customers that makes it very easy for RedHawk-SC to guide Synopsys implementation tools in the efficient resolution of dynamic voltage drop (DVD) issues without negatively impacting the power, performance, or area of the chip.
· RedHawk-SC Electrothermal’s speed, accuracy, and quality-of-results for system thermal analysis have significantly advanced with support for hierarchical Chip Thermal Models and optimization of designs with thermal sensors that throttle performance.
· Ansys’ suite of electromagnetic simulation tools for on-chip analysis now added a distributed compute capability that breaks through any tool capacity limitations and makes it possible to model cutting-edge systems-on-chip (SoCs) and multi-die 3D-ICs.
· New capabilities in PowerArtist further power analysis of real application scenarios with a new fast time-based engine and distributed analysis
· The new RaptorQ product is the only solution currently on the market for electromagnetic modeling of quantum computing applications on superconductive silicon.


2022 R1 introduces a new product, Ansys Forming. Ansys Forming is an all-in-one forming simulation software built to digitally design and validate every step of the sheet metal forming process leveraging the speed and accuracy from the LS-DYNA solver.
Increased confidence in correlating test and simulation data with the new NVH (Noise Vibration Harshness) toolkit inside Mechanical. Users can easily read in physical test data and compute the MAC (Modal Assurance Criteria) to compare simulation data and physical test data.
Introducing Directed Energy Deposition (DED) process simulation to the Ansys Additive Portfolio, providing capabilities from predicting macro-level temperature distortions and stresses to prevent build failures and provide trend data for improving designs for additive manufacturing including part orientation and part build order.
Additional insights into PCB thermal performance with high-fidelity PCB models from Sherlock that can now be exported to Ansys AEDT Icepak for thermal analysis simulations.