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// Ansys Sherlock

Product life prediction: : Ansys Sherlock

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Sherlock lets designers predict failure risks due to thermal, mechanical and manufacturing stress: all at a pre-prototyping stage.

The automatic analysis performed by Ansys Sherlock provides rapid and accurate life predictions for electronic hardware at a parts, boards and systems level during the initial design stages.  Sherlock allows designers to accurately model silicon and metal layers, semiconductor packaging, printed circuit boards and assemblies to prevent failure risks due to thermal, mechanical and manufacturing stress.

ansys sherlock simulazione stress termici e meccanici

With integrated libraries containing over 500,000 parts, Sherlock rapidly converts computer-aided design (ECAD) files into computational fluid dynamic (CFD) and finite element analysis models (FEA). Each model contains accurate geometrics and material properties, and translates information on stress into failure time predictions.

Unlike all other tools on the market, Sherlock uses the files created by your design team to build 3D models of electronic assemblies to model sketches, and perform post-processing of finite element analysis and reliability predictions. This initial intuition translates into almost instant identification of the relevant areas and gives you the possibility to adjust and quickly test the designs.

Main features:
• Build and test virtual products
• Modify designs in near real-time
• Quickly perform mechanical simulations
• Assess and optimise design decisions

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